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Copper Metallized PP Film

 
 
  • Total thickness: (10μm to over 100μm) with a tolerance of ±3μm
  • PP layer thickness: (≥4μm) + copper layer (≥0.1μm)
  • Tensile strength: ≥30Mpa
  • Width: 0.5mm to 990mm
  • Elongation rate: ≥30% minimum
  • Packaging: rolls (D30), sheets, 76mm removable rolls, inverted cone packaging
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Polyester Film Tape (PET Tape)

Shielding Laminates

Vacuum Metallized Films & Fabrics

Copper metallized PP film
Copper vapor-deposited onto film in a vacuum. High dielectric, excellent insulation, heat resistance.

Polypropylene (PP)
Semi-crystalline thermoplastic, strong impact resistance, robust mechanical properties, and resistance to various organic solvents and acid-base corrosion

Features

  • Suitable for uneven surfaces
  • Offers high flexibility
  • Easy to use

Applications

  • Flame retardant materials
  • Thermal conductive materials
  • Data transmission cable
  • EMI shielding

Vacuum metallization includes vacuum deposition, sputtering, ion plating and other methods to form various metallic and non-metallic thin films on the surface of products in a vacuum environment to achieve the effect of electroplating.

In a vacuum, the coating material is evaporated or sputtered and deposited onto the substrate to form a thin film. Since there are no air molecules to interfere, the coating material can travel in straight lines and form highly uniform layers.

Copper/PET shielding tapes is primarily used in various fields, such as extremely fine coaxial wires, low-loss antennas (computers), solar cell wires, etc.

EMI solutions include three main approaches: electromagnetic interference shielding, printed circuit board grounding, and electromagnetic interference absorption.

  • Electromagnetic Interference Shielding involves blocking electromagnetic noise and attenuating cable-collected noise. It uses high-reflectance materials (usually low-resistance metals) to encase or seal openings in target devices for EMI and EMS solutions.
  • Printed Circuit Board (PCB) Grounding refers to grounding electronic equipment electrically to prevent electric shock, treating the Earth as a massive conductor at zero electric potential. Two grounding methods are employed: frame grounding and signal grounding on PCBs.
  • Electromagnetic Interference Absorption (EMI Absorption) utilizes magnetic loss, dielectric loss, and conduction loss to convert radio wave energy into thermal energy. EMI absorbers have a wide range of applications.
 
Shielding Materials
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Metallized Conductive Fabric

Copper Metallized PPS Film

Copper Metallized PPS Film

Copper Metallized PI Film

Copper Metallized PI Film

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