Copper Metallized PET Film

Vacuum metallized polyester film

By depositing copper in a vacuum onto the film’s surface, copper metallized PET film features a high dielectric constant, outstanding insulation resistance, thermal insulation, and robust tensile properties.

 

Features

Applications

The main difference between electroplating and vacuum metallizing is cost. Vacuum metallization is usually more expensive and has a higher process complexity than electroplating.

In a vacuum, the coating material is evaporated or sputtered and deposited onto the substrate to form a thin film. Since there are no air molecules to interfere, the coating material can travel in straight lines and form highly uniform layers.

We can process a wide range of materials, including non-metallic materials such as PEN, PET, PPS, PP, PI, PTFE, EPTFE, etc., as well as a variety of metal materials such as aluminum, copper, gold, silver, nickel, tin and indium.
 
 

EMI solutions consist of three main routes: EMI shielding, printed circuit board grounding and EMI absorption.

  • Electromagnetic Interference Shielding involves blocking electromagnetic noise and attenuating cable-collected noise. It uses high-reflectance materials (usually low-resistance metals) to encase or seal openings in target devices for EMI and EMS solutions.
  • Printed Circuit Board (PCB) Grounding refers to grounding electronic equipment electrically to prevent electric shock, treating the Earth as a massive conductor at zero electric potential. Two grounding methods are employed: frame grounding and signal grounding on PCBs.
  • Electromagnetic Interference Absorption (EMI Absorption) utilizes magnetic loss, dielectric loss, and conduction loss to convert radio wave energy into thermal energy. EMI absorbers have a wide range of applications.
 
Shielding Materials
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