Copper/PI Shielding Tape

Polytetrafluoroethylene film laminated aluminum foil

  • Total Thickness: (10μm to over 100μm) ±3μm
  • PI Layer Thickness: (≥2μm) + Copper Layer (≥0.1μm)
  • Tensile Strength: ≥30Mpa
  • Width: 0.5mm to 990mm
  • Elongation: ≥30% Min
  • Packaging: rolls(D30), sheets, 76mm removable rolls, inverted cone packaging

Copper/PI shielding tape is a polyimide film laminated with a copper foil layer and is widely used in flexible printed circuits (FPC). It has excellent physical, chemical, and electrical properties, is resistant to atomic radiation, solvents, low and high temperatures, and can operate successfully over a wide temperature range from as low as -452°F (-269°C) to as high as to +752°F (+400°C). Because of its unique and outstanding properties, Cu/Pi shielding tape is the preferred choice for many insulation applications.

Polyimide (PI) plastic is currently one of the best heat-resistant engineering plastics, some varieties of long-term resistance to high temperatures of 290 ℃, short-term can withstand high temperatures of up to 490 ℃. In addition, it also has good mechanical properties, fatigue resistance, flame retardancy, dimensional stability, electrical properties, low molding shrinkage, oil resistance, resistance to common acids and organic solvents. However, it is not alkali resistant, but has excellent resistance to frictional wear.



Unlike metals, shielding laminates are non-conductive at their core. While metals such as copper are inherently conductive, shielding laminates formed from non-metals are ideally suited for use as insulation or signal shielding materials that do not respond to electric fields and resist the flow of charge.

Metal shielding laminates are produced by continuously bonding two thin metal sheets or natural metal films to one side of a thermoplastic core. These cores form sheets that are lighter in weight, easy to fabricate, flat and durable.

Copper ions have high reactivity in the presence of air and react easily with oxygen ions to form copper oxide. Although we treat the surface of the copper foil with a room temperature antioxidant process during production, this treatment only retards the oxidation of the copper foil. Therefore, it is recommended to use the copper foil as soon as possible after opening. Unused copper foils should be stored in a dry place, protected from light and away from volatile gases. The recommended storage temperature for copper foils is approximately 25 degrees Celsius with a humidity not exceeding 70%. material from a vapor phase to a solid film.
Slightly oxidized copper foil surfaces can be cleaned using an alcohol sponge. However, for long-term or extensive oxidation, a sulfuric acid solution is required to clean and remove oxidation.
Shielding Materials

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