Copper/PET Shielding Tape

Polyester film laminated copper foil with PUR hot melt adhesive

  • Total Thickness: (From 10μm to over 100μm) ±3μm
  • PET Layer Thickness: (≥1.6μm) + Copper Layer (≥4μm)
  • Tensile Strength: ≥30Mpa
  • Width: 0.5mm to 990mm
  • Elongation: ≥30% Min
  • Packaging: rolls(D30), sheets, 76mm removable rolls, converted cone packaging

Copper foil provides electrical conductivity and electromagnetic insulation. PET film provides electrical insulation and high mechanical strength. Copper foils are corrosion-resistant, radiation-resistant, solderable and have a higher electrical conductivity than aluminum foils. We also offer adhesive-free foil laminates tailored to your needs.



Unlike metals, shielding laminates are non-conductive at their core. While metals such as copper are inherently conductive, shielding laminates formed from non-metals are ideally suited for use as insulation or signal shielding materials that do not respond to electric fields and resist the flow of charge.

Shielding laminates consist of at least two materials whose combined performance exceeds that of their individual components. In our context, we refer to shielding laminates consisting of both metals and non-metals, usually involving a combination of PET, PP, PI, PPS, PTFE with metals such as copper and aluminum.

Copper foil is an extremely thin copper material that can be categorized into calendered copper foil (RA) and electrolytic copper foil (ED) depending on the manufacturing process. Copper foil has excellent electrical and thermal conductivity and is known for its ability to shield electrical and magnetic signals. It is widely used in the manufacture of precision electronic components. With the advancement of modern manufacturing, there is a growing demand for thinner, lighter, smaller and more portable electronic products, which leads to a wider application of copper foil.

RA copper foil and ED copper foil have their respective advantages and disadvantages.

  • RA copper foil is purer in terms of copper content.
  • RA copper foil offers better overall physical performance compared to electrolytic copper foil.
  • Both types of copper foil have nearly identical chemical properties.
  • In terms of cost, ED copper foil is usually less expensive due to its simpler manufacturing process and the ease of mass production.
  • Typically, RA copper foil is used in the early stages of product manufacturing, but as manufacturing processes mature, ED copper foil is often utilized to reduce costs.

Copper ions have high reactivity in the presence of air and react easily with oxygen ions to form copper oxide. Although we treat the surface of the copper foil with a room temperature antioxidant process during production, this treatment only retards the oxidation of the copper foil. Therefore, it is recommended to use the copper foil as soon as possible after opening. Unused copper foils should be stored in a dry place, protected from light and away from volatile gases. The recommended storage temperature for copper foils is approximately 25 degrees Celsius with a humidity not exceeding 70%.

Shielding Materials

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