Copper Metallized PI Film

Vacuum metallized polyimide film

  • Total thickness: (10μm to over 100μm) with a tolerance of ±3μm
  • PI layer thickness: (≥2μm) + copper layer (≥0.1μm)
  • Tensile strength: ≥30Mpa
  • Width: 0.5mm to 990mm
  • Elongation rate: ≥30% minimum
  • Packaging: rolls (D30), sheets, 76mm removable rolls, inverted cone packaging

Copper-metallized PI film is a film formed by vacuum metallization on a polyimide substrate and is known for its excellent adhesion and electrical insulation properties. PI plastic is one of the most heat-resistant engineering plastics, with some variants able to withstand long-term exposure to 290°C and short-term exposure to 490°C. It also has strong mechanical properties, fatigue resistance, flame retardancy, dimensional stability, good electrical properties, low molding shrinkage, and is resistant to oils, common acids and organic solvents. However, copper-metallized PI films are not alkali resistant, but have excellent friction and wear properties.

Features

Applications

Unlike metals, shielding laminates are non-conductive at their core. While metals such as copper are inherently conductive, shielding laminates formed from non-metals are ideally suited for use as insulation or signal shielding materials that do not respond to electric fields and resist the flow of charge.

The main difference between electroplating and vacuum metallizing is cost. Vacuum metallization is usually more expensive and has a higher process complexity than electroplating.

In the vacuum, materials for coating are evaporated or sputtered, and they deposit onto the substrate, forming a thin film. The absence of air molecules interference allows the coating material to travel straight and create a highly uniform layer.
 
 
Copper/PET shielding tapes is primarily used in various fields, such as extremely fine coaxial wires, low-loss antennas (computers), solar cell wires, etc.
 

EMI solutions consist of three main routes: EMI shielding, printed circuit board grounding and EMI absorption.

  • Electromagnetic Interference Shielding involves blocking electromagnetic noise and attenuating cable-collected noise. It uses high-reflectance materials (usually low-resistance metals) to encase or seal openings in target devices for EMI and EMS solutions.
  • Printed Circuit Board (PCB) Grounding refers to grounding electronic equipment electrically to prevent electric shock, treating the Earth as a massive conductor at zero electric potential. Two grounding methods are employed: frame grounding and signal grounding on PCBs.
  • Electromagnetic Interference Absorption (EMI Absorption) utilizes magnetic loss, dielectric loss, and conduction loss to convert radio wave energy into thermal energy. EMI absorbers have a wide range of applications.
 
Shielding Materials
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