Copper Metallized PPS Film

Vacuum metallized polyphenylene sulfide film

  • Total thickness: (10μm to over 100μm) with a tolerance of ±3μm
  • PPS layer thickness: (≥2μm) + copper layer (≥0.1μm)
  • Tensile strength: ≥30Mpa
  • Width: 0.5mm to 990mm
  • Elongation rate: ≥30% minimum
  • Packaging: rolls (D30), sheets, 76mm removable rolls, inverted cone packaging

Copper Metallized PPS Film is an electrically insulating film using PPS film, which is commonly used in the capacitor field due to its performance characteristics. PPS plastic (polyphenylene sulfide) is a high-performance thermoplastic engineering plastic known for its superior properties, including high temperature resistance, corrosion resistance, and excellent mechanical properties.

Features

Applications

Unlike metals, shielding laminates are non-conductive at their core. While metals such as copper are inherently conductive, shielding laminates formed from non-metals are ideally suited for use as insulation or signal shielding materials that do not respond to electric fields and resist the flow of charge.

IP stands for Ion Plating, a more detailed categorization of PVD technology. PVD methods include vacuum deposition, sputtering and ion plating (IP). IP is considered the best technology for adhesion and durability.

In a vacuum, the coating material is evaporated or sputtered and deposited onto the substrate to form a thin film. Since there are no air molecules to interfere, the coating material can travel in straight lines and form highly uniform layers.
 

EMI solutions consist of three main routes: EMI shielding, printed circuit board grounding and EMI absorption.

  • Electromagnetic Interference Shielding involves blocking electromagnetic noise and attenuating cable-collected noise. It uses high-reflectance materials (usually low-resistance metals) to encase or seal openings in target devices for EMI and EMS solutions.
  • Printed Circuit Board (PCB) Grounding refers to grounding electronic equipment electrically to prevent electric shock, treating the Earth as a massive conductor at zero electric potential. Two grounding methods are employed: frame grounding and signal grounding on PCBs.
  • Electromagnetic Interference Absorption (EMI Absorption) utilizes magnetic loss, dielectric loss, and conduction loss to convert radio wave energy into thermal energy. EMI absorbers have a wide range of applications.
 
Shielding Materials
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